| PART |
Description |
Maker |
| D-300-08CS1108 D-300-08CS1108-ND D-300-18 D-300-12 |
CAP, SPLICE ENCAPSULATION
|
PANDUIT CORP.
|
| D-300-03 D-300-01 D-300-02 610016-000 610015-000 6 |
CAP, SPLICE ENCAPSULATION
|
PANDUIT CORP.
|
| SM2615 |
High temperature molded encapsulation
|
List of Unclassifed Man...
|
| ASMT-JB11-NMP01 |
Silicone Encapsulation for LED Advantages and Handling Precautions
|
AVAGO TECHNOLOGIES LIMITED
|
| 2946117 |
Covering hood, for the contact and dust-protected encapsulation of the components, in green design.
|
PHOENIX CONTACT
|
| 40CPQ015 |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
Sangdest Microelectroni...
|
| 201CNQ035 201CNQ040 201CNQ045 |
SCHOTTKY RECTIFIER
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
Sangdest Microelectroni...
|
